Ph.D. Seminar topic Analytical and Numerical Modeling of Subwavelength Plasmonic-waveguide Components for Nanophotonic Applications

Recently, in optics there has been a surge of interest in miniaturized metallic structures
that allow sub-wavelength control of electromagnetic energy in the infrared and visible
bands of the spectrum. This results an emerging field of science known as plasmonics,
which has plethora of applications such as nanoscale optical interconnects,
chemical/bio-sensors, high-resolution microscopy, etc.
This research aims to investigate various plasmonic waveguide-based optical
components in terms of equivalent transmission-line networks. This representation
allows one to use classical network analysis tools in microwave engineering to obtain
analytical expressions that describe the transmission response of useful devices in
nanophotonics. The derived formulae provide rapid design optimization paths unlike the
computationally expensive and time consuming numerical simulations.

Advanced Optical Functionalities in Photonic Crystals

High-quality self-assembled three-dimensionally-ordered photonic crystals have been synthesized with inorganic and polymeric colloids. These crystals display a pseudo bandgap in the UV / visible / near-IR regions with high values of reflectance combined with low transmission. The stop band characteristics have been modified after infiltrating these passive photonic crystals with materials such as ZnO as well as by synthesizing active photonic crystals directly from colloids made of organic dye-polymer composites. The emission characteristics of these active species are modified by the photonic crystal    environment due to the anisotropic stop band. It has been possible to fabricate photonic crystal heterostructures as well as photonic crystal waveguides for building functionalities into photonic integrated circuits.  BJ93GJCCMXAR

Applications of integrated Image and Ladar Sensors for UAV's

Abstract:

Small unmanned air vehicles UAV's have the potential to provide real-time surveillance information for a wide range of applications in a relatively low-cost and low risk manner. Potential applications for these include search and rescue, coastal surveillance, fire spotting, and defence.

AUTOSAR

AUTOSAR(Automotive Open System Architecture) The idea behind AUTOSAR is to create an open standard for fundamental software system functions that replaces proprietary standards. This creates a plug-and-play environment where software modules slot into the overall electronic architecture without unexpectedly disrupting others The objective of the partnership is the establishment of an open standard for automotive E/E architecture. It will serve as a basic infrastructure for the management of functions within both future applications and standard software modules. The goal is to have a standardized tool chain that will guide and assist the design engineer through the complete process.

ADVANCED IC PACKAGING TECHNOLOGIES

ABSRACT
ADVANCED IC PACKAGING TECHNOLOGIES

The many different functions of semiconductor devices are made possible by integrated circuits, which are built into the surface of a silicon chip (bear chip) using a complex process. If these chips could be used in unmodified form, packaging would be unnecessary, and the cost of chips reduced. However, because silicon chips are very delicate, even a tiny speck of dust or drop of water can hinder their function. Light can also cause malfunctions. To combat these problems, silicon chips are protected by packaging. There are many different technologies used for packaging components on printed circuit boards. The conventional through –hole technology has now being replaced by a new technology known as Surface Mount Technology (SMT). Surface Mount Technology is a method for constructing electronic circuits in which the components are mounted directly onto the surface of printed circuit boards (PCBs).Electronic devices so made are called Surface Mount Devices (SMDs). Various other technologies like Ball Grid Array(BGA),Flip-Chip technology, Chip-scale technology,Multichip modules are also emerging which are supposed to take over the existing packaging technologies and are can clearly be defined as future technologies in the field of IC packaging.